![]() ![]() ![]() REL61 provides the electronics assembly marketplace a low cost alternative to SAC alloys that has the reliability and performance characteristics equal to or greater than SAC305 and other low/no-silver solder alloys. REL61 has repeatedly demonstrated reliability gains over SAC305 and other low/no silver alloys in thermal cycling performance such as LED lighting, in-cabin automotive electronics and high power applications. Handling and Storage: - NC258 Paste Flux has a refrigerated shelf life of 1 year at 4☌ (40☏) to 12☌ (55☌), and 6 months at room temperature. Please refer to the AIM Cleaner Matrix for a list of suitable cleaning materials. AIM Sn62/Pb36/Ag2 can lower costs, increase productivity and reduce defects. NC258 Paste Flux can be cleaned, if necessary, with saponified water or an appropriate solvent cleaner. Sn62/Pb36/Ag2 AIM ElectropureTM solder is manufactured using responsibly sourced, high purity elements resulting in low dross, high fluidity solder. REL61 is ideally suited for competitive industries which need a lower cost, enhanced durability alloy. Sn62/Pb36/Ag2 is a eutectic alloy with a melting point of 179☌ (354☏). Developed with the input of coating and cleaning industry partners, residues can be directly coated or easily removed. If you are searching for information that you. Please select a link below to learn more about our solder products. We offer a wide variety of advanced solder materials to assist in any application. ![]() M8 leaves minimal, high purity, residue, engineered to be safely left in place. AIM Solder is a leading global manufacturer and technical support provider of tin-lead and lead-free solder assembly materials. M8 eliminates HiP defects on BGA and reduced voiding on QFN/BTC components while producing bright shiny solder joints. A novel activator system provides powerful, durable wetting action accommodating a wide range of profiling processes and techniques. NC254 provides excellent wetting and low post process residues, which remain crystal clear and probable at elevated temperatures. DJAW-10 can be hand applied or used in under stencil wipe equipment. NC254 flux system is engineered to withstand the unique requirements of solder paste dispensing including repeated mechanical cycling. Developed in combination with T4 and finer mesh lead-free alloy powders, M8 provides stable transfer efficiencies required for today’s challenging applications. CLEANING: Pre-Reflow: AIM DJAW-10 effectively removes M8 solder paste from stencils while in process. An evolution of the highly successful NC258 platform, M8 brings no clean solder paste to the next level. Paste Application Solder paste should be taken out of the refrigerator at least 3 to 6 hours prior to use. The external air pressure supply should be maintained constant. An evolution of the highly successful NC258 platform, M8 brings no clean solder paste to the next level. In cases where a paste requires much higher pressure (more than 40 lb/in² or 2.82 kg/cm²) to dispense, the paste will become inconsistent and clogging may be expected. 230-238.AIM M8 no clean solder paste is designed for the most demanding high density electronic assemblies. AIM M8 no clean solder paste is designed for the most demanding high density electronic assemblies. NC257-2 was developed for use in air reflow, but can be used in both N2 and vapor-phase reflow processes as well. NC257-2 produces bright, smooth and shiny solder joints and very clear, low volume post soldering residue. (2022), "Influence of the soldering paste type on optical and thermal parameters of LED modules", Soldering & Surface Mount Technology, Vol. NC257-2 has been developed to offer extremely broad process windows for printing, wetting and pin-probe testing. ![]() (Prof Krzysztof Górecki and Dr Przemysław Ptak). DJAW-10 will not dry M8 and will enhance transfer properties. DJAW-10 can be hand applied or used in under stencil wipe equipment. Pre-Reflow: AIM DJAW-10 effectively removes M8 solder paste from stencils while in process. 16.16.230.434) for AGH Faculty of Computer Science, Electronics and Telecommunications (Dr Barbara Dziurdzia) and the project called “Regionalna Inicjatywa Doskonałości” in the years 2019–2022, project number 006/RID/2018/19, the sum of financing 11,870,000 PLN. See AIM’s paste handling guidelines for further information. This paper was partially supported by the Polish Ministry of Science and Higher Education within the framework of subvention for science in 2021 (No. It was shown that the best thermal and optical properties of these modules are obtained for the OM5100 paste by Alpha Assembly. RMA258-15R reduces voiding on BGA/BTC and eliminates head-in-pillow defects. RMA258-15R offer long pause-to-print capabilities even on miniaturized devices. This paper shows the investigations results in the area of effective assembly of power LEDs to the metal core printed circuit board (MCPCB) using different soldering pastes (REL22, REL61, LMPA-Q6, OM-5100, OM-338-PT, M8, OM-340, CVP-390). RMA258-15R rosin based solder paste has been developed for assemblers of high reliability and military electronics. ![]()
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